Intel® Core™ i7-860 Processor
(8M Cache, 2.80 GHz)
SPECIFICATIONS
| Essentials | ||
| Status | Launched | |
| Launch Date | Q3'09 | |
| Processor Number | i7-860 | |
| # of Cores | 4 | |
| # of Threads | 8 | |
| Clock Speed | 2.8 GHz | |
| Max Turbo Frequency | 3.46 GHz | |
| Intel® Smart Cache | 8 MB | |
| DMI | 2.5 GT/s | |
| Instruction Set | 64-bit | |
| Instruction Set Extensions | SSE4.2 | |
Embedded Options Available
|
Yes | |
| Lithography | 45 nm | |
| Max TDP | 95 W | |
| VID Voltage Range | 0.6500V-1.4000V | |
| Recommended Customer Price | TRAY: $288.00 | |
| Memory Specifications | ||
| Max Memory Size (dependent on memory type) | 16 GB | |
| Memory Types | DDR3-1066/1333 | |
| # of Memory Channels | 2 | |
| Max Memory Bandwidth | 21 GB/s | |
| Physical Address Extensions | 36-bit | |
|
ECC Memory Supported ‡
|
No | |
| Graphics Specifications | ||
| Processor Graphics | No | |
| Expansion Options | ||
| PCI Express Revision | 2.0 | |
| PCI Express Configurations ‡ | 1x16, 2x8 | |
| Max # of PCI Express Lanes | 1 | |
| Package Specifications | ||
| Max CPU Configuration | 1 | |
| TCASE | 72.7°C | |
| Package Size | 37.5mm x 37.5mm | |
| Processing Die Size | 296 mm2 | |
| # of Processing Die Transistors | 774 million | |
| Sockets Supported | LGA1156 | |
| Low Halogen Options Available | See MDDS | |
| Advanced Technologies | ||
| Intel® Turbo Boost Technology ‡ | Yes | |
|
Intel® vPro Technology ‡
|
Yes | |
|
Intel® Hyper-Threading Technology ‡
|
Yes | |
|
Intel® Virtualization Technology (VT-x) ‡
|
Yes | |
|
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
|
Yes | |
|
Intel® VT-x with Extended Page Tables (EPT) ‡
|
Yes | |
|
Intel® Trusted Execution Technology ‡
|
Yes | |
|
AES New Instructions
|
No | |
|
Intel® 64 ‡
|
Yes | |
| Idle States | Yes | |
|
Enhanced Intel SpeedStep® Technology
|
Yes | |
|
Intel® Demand Based Switching
|
No | |
| Thermal Monitoring Technologies | No | |
| Execute Disable Bit ‡ | ||
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